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环境学术沙龙第627期:Biochar in soils: From sorbent of pollutants toclimate-s...
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全球变化科学紫荆论坛第402期:干涉雷达(InSAR)大尺度森林参数提取及变化、干扰监测
清华大学工业深度减碳论坛
报告题目:
Degradation of hexagonal silicon carbide-based bipolar devices
 报告人:
Prof. Marek Skowronski
报告时间:
2005-09-15 10:00
报告地点:
清华大学材料院学术报告厅(逸夫技术科学楼2-321室)
主办单位:
清华大学材料科学与工程研究院
  简介:

 

Degradation of hexagonal silicon carbide-based bipolar devicesM. Skowronski Department of Materials Science and Engineering, Carnegie Mellon UniversitySilicon carbide displays multiple characteristics that make it ideally suited for efficient high voltage switching devices.  However, the commercialization of this technology has been hampered by degradation of SiC p-n junctions due to the expansion of Shockley-type stacking faults.  The faults gradually cover most of the junction area and impede current flow. This talk will cover the properties of faults in hexagonal SiC polytypes and their bounding dislocations as well as the mechanism and driving force for fault expansion.  The approaches to materials growth and processing leading to elimination of this effect will be discussed. 

 

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