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清华环境论坛第115期:选题与立项之问
清华大学-美团数字生活联合研究院学术沙龙第16期:互联网传送协议优化研究
环境学术沙龙第606期:水创新与未来的能源安全(Water Innovation and Energy Secu...
材料科学与工程研究院《材料科学论坛》学术报告:Microscale 3D Assembly
报告题目:
Degradation of hexagonal silicon carbide-based bipolar devices
 报告人:
Prof. Marek Skowronski
报告时间:
2005-09-15 10:00
报告地点:
清华大学材料院学术报告厅(逸夫技术科学楼2-321室)
主办单位:
清华大学材料科学与工程研究院
  简介:

 

Degradation of hexagonal silicon carbide-based bipolar devicesM. Skowronski Department of Materials Science and Engineering, Carnegie Mellon UniversitySilicon carbide displays multiple characteristics that make it ideally suited for efficient high voltage switching devices.  However, the commercialization of this technology has been hampered by degradation of SiC p-n junctions due to the expansion of Shockley-type stacking faults.  The faults gradually cover most of the junction area and impede current flow. This talk will cover the properties of faults in hexagonal SiC polytypes and their bounding dislocations as well as the mechanism and driving force for fault expansion.  The approaches to materials growth and processing leading to elimination of this effect will be discussed. 

 

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