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报告题目:
材料院《材料科学论坛》:“Think Thermally” – The Role of Thermophysical Properties in Materials Science
 报告人:
Dr. Hsin Wang
Senior R&D Staff, Scattering and Thermophysics Group, 
Materials Science and Technology Division, 
Oak Ridge National Laboratory, Oak Ridge, TN, USA
报告时间:
2013-12-06 10:00
报告地点:
清华大学材料院学术报告厅(逸夫技术科学楼2-321)
主办单位:
材料院《材料科学论坛》:联系人:李敬锋 老师 62784845 欢迎广大师生踊跃参加
  简介:


Abstract:
Thermophysical properties are sometimes viewed as a traditional branch of physics and material science.  In other words, it may seem less exciting to some researchers and students.  In this presentation, I will use my 18-year research experience at the Oak Ridge National Laboratory (ORNL) to demonstrate: if you “think thermally”, this is an exciting field with lots of opportunities for advancement and discoveries. I will present examples of the roles of thermophysical properties played in: vehicles technologies, power grid applications (lightning/surge arresters), thermal-to-electric energy conversion, and Li-ion battery safety.  I hope to convey a clear message: heat, temperature, and thermophysical properties are very important to all areas of materials science.

Biosketch:
EDUCATION:
B.S., Solid State Physics, TsingHua University, Beijing, 1989
M.S. Ceramic Science, New York State College of Ceramics at Alfred University, 1991
Ph.D. Ceramics, New York State College of Ceramics at Alfred University, 1994

PROFESSIONAL EXPERIENCE:
2005-present     Senior Research Staff, Materials Science & Technology Division, ORNL
1997-2004Research Staff, Metal & Ceramics Division, ORNL
1995-1997Postdoctoral Fellow, Metals and Ceramics Division, ORNL
2009-present     Annex VIII leader on thermoelectric materials for the International Energy Agency – Advanced Materials for Transportation (IEA-AMT)
2007-2011Chairman of the board of governors of the International Thermal Conductivity Conference, Inc.
2012-2015Board member of International Thermoelectric Society, chairman of ICT2014 in Nashville, TN
2010-present     Journal guest editor, reviewer, Journal of Electronic Materials, International Journal of Thermal Sciences
Membership:    American Ceramic Society, MRS, International Thermoelectric Society

 

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