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第九期“城市前沿讲堂”——Household Sustainability
Beyond the Green Facade: A Field Experiment on Environmental Narrativesin Fin...
”行业前沿讲堂”第3期——数据治理赋能数字化转型和数据资产化
量子计算+化学小型研讨会
报告题目:
Creating Semiconductor Devices at the Atomic Scale
 报告人:
Richard A. Gottscho博士 美国泛林集团执行副总裁兼首席技术官
报告时间:
2017-11-22 10:30
报告地点:
清华大学FIT楼二层报告厅
主办单位:
清华大学微电子学研究所 北京市未来芯片技术高精尖创新中心
  简介:

Deposition and etching of thin films are more critical than ever to the formation of nanometer-sized features in the manufacturing of integrated circuits. As features shrink to 3 nm and below, deposition and etching techniques are needed to extend the capability of patterning, which is only the first step in the fabrication sequence. Likewise, as devices scale vertically, for example in 3D NAND and cross-point phase change memories, the fabrication of complex structures relies more on advances in deposition and etching than in lithography. Specifically, atomic layer deposition (ALD) and atomic layer etching (ALE) are multi-step processes used to place and remove ultra-thin layers of material where desired. In this talk, I'll explore the chemical and physical mechanisms that enable atomic scale engineering that in turn enables future advances in electronic systems.

 

在集成电路制造过程中,在纳米尺度结构的行程过程中,薄膜的沉积和刻蚀越来越重要和关键。由于特征尺寸缩小至3纳米及以下,需要沉积和蚀刻技术来提高光刻的能力,这仅仅是制造顺序的第一步。同样,随着器件尺寸在垂直方向减小,例如在三维NAND和交叉点阵相变存储器中,复杂结构的制造更多地依赖于沉积和刻蚀方面的技术进展,而不是靠光刻技术提升。具体来说,原子层沉积(ALD)和原子层刻蚀(ALE)是多步过程,用于在需要的地方放置和去除超薄层材料。在本次讲座中,我将探索使原子尺度的工程化的化学和物理机制,进而推动未来芯片技术的发展。

 

Dr. Richard A. Gottscho

Lam Research, Executive Vice President and Chief Technology Officer

 

Richard A. Gottscho博士

美国泛林集团执行副总裁兼首席技术官

 

 

 

 

Rick and his global team are bringing together Lam’s technology vision, pursuing disruptive technologies to enable step-function improvements in performance and productivity and accelerating opportunity for customers.

 

He’s served at various director and vice presidential levels since joining the company in January 1996, most recently as head of the Global Product Group. Prior to joining Lam Research, Rick was a member of Bell Laboratories for 15 years, where he headed research departments in electronics materials, electronics packaging, and flat panel displays. He earned his Ph.D. and B.S. degrees in Physical Chemistry from the Massachusetts Institute of Technology and Pennsylvania State University. In 2016, Rick was inducted into the National Academy of Engineering.

 

Richard和他的全球团队正在将泛林集团的技术愿景结合在一起,追求颠覆性技术,以便在性能和生产力方面实现进一步改进,并为客户提供更多的机会。

 

19961月加入公司以来,他担任过各种董事和副总裁职务,最近担任全球产品集团负责人。加入泛林集团之前,Richard曾在贝尔实验室任职15年,主要负责电子材料、电子封装和平板显示器研究部门。他已获得美国麻省理工学院和宾夕法尼亚州立大学物理化学的博士学位和学士学位。2016年,Richard获得美国国家工程院院士。
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