Biography

Dr. Thorsten Lill is VP of Emerging Etch Technologies and Systems at Lam Research. He holds a Ph.D. in Physics from the Albert-Ludwigs-University in Freiburg, Germany. In Freiburg, he studied collisions of C60 and C70 fullerenes with crystalline surfaces in ion and laser beam experiments. After his graduate studies, he spent time as a post doc researcher at the Chemistry Department at the Argonne National Laboratory working on sputtered metal cluster experiments with Secondary Neutral Mass Spectrometry with laser post ionization. He has published over 130 articles and conference papers including first author articles in Physical Review Letters and Science and holds 62 granted patents in the fields of plasma and ion beam sources, plasma etching, Atomic Layer Etching, CVD, reactor design, and diagnostics.

 

Thorsten Lill副总裁在泛林集团致力于新兴刻蚀技术和系统的研究。他拥有德国阿尔伯特－路德维希－弗莱堡大学物理学博士学位。在弗莱堡，他研究了C60和C70富勒烯在离子环境中与激光晶体表面的碰撞实验。毕业后，作为博士后研究员在阿贡国家实验室化学系工作，致力于使用二次中性质谱研究激光电离的溅射金属团簇。他已发表了130多篇期刊与会议论文，其中包括以第一作者身份发表《物理评论快报》和《科学》，此外他还在等离子体和离子束源、等离子刻蚀、Atomic Layer Etching、CVD、反应器设计和诊断等领域拥有62项授权的专利。

 

Abstract

Plasma etching or Reactive Ion Etching (RIE) is the workhorse for patterning of semiconductor devices since the early 1980-ies when it replaced wet etching in manufacturing. Today, RIE is reaching levels of performance which were unimaginable back then. At the same time, etching technologies such as Atomic Layer Etching (ALE), radical, dry vapor and Ion Beam Etching are finding their way into manufacturing for certain applications.                                                                                                                                                                            

We will present an overview of dry etching technologies used in semiconductor manufacturing. The emphasis is on the elementary surface processes and how they impact the performance on the wafer. We will start from less complex etching technologies which use just one kind of etching species, such as neutrals, radicals or ions. Then we combine these techniques into cycling processes which leads to the discussion of ALE. The highest level of complexity is reached in RIE with simultaneous species fluxes. Reactor designs for the various etching technologies and process control will be covered. Finally, an outlook into the future of semiconductor device etching will be given.

自1980年以来，等离子刻蚀、反应离子刻蚀（RIE）逐渐取代湿式刻蚀成为图形化的半导体器件的主要工艺。到今天，RIE的性能已经达到了难以想象的水平。同时，原子层刻蚀（ALE），自由基，干蒸汽和离子束等刻蚀技术正在逐渐找到他们的应用场景。

本次报告中，Thorsten Lill将为我们介绍半导体制造中的干法刻蚀技术。重点是刻蚀中的基本表面过程以及它们对晶元性能的影响。报告将从只使用一种刻蚀物质的简单刻蚀技术开始，如中性、自由基或离子刻蚀。然后，这些技术将融入到循环过程中，从而帮助我们深入研究ALE。同时，我们将会了解如何达到RIE的最高水平即同时控制多种反应气流。反应物设计将涵盖各种刻蚀技术和过程控制。最后，Thorsten Lill副总监将为我们展望半导体器件刻蚀技术的发展前景。

 

About Lam Research:

Lam Research Corp. is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. As a trusted, collaborative partner to the world's leading semiconductor companies, we combine superior systems engineering capability, technology leadership, and unwavering commitment to customer success to accelerate innovation through enhanced device performance. In fact, today, nearly every advanced chip is built with Lam technology. Lam Research (Nasdaq:LRCX) is a FORTUNE 500® company headquartered in Fremont, Calif., with operations around the globe. Learn more at www.lamresearch.com. (LRCX-F)

 

关于泛林集团:

 

泛林集团是全球半导体产业创新晶圆制造设备及服务主要供应商。泛林集团提供行业领先的多元化产品组合，包括薄膜沉积、电浆刻蚀和晶圆清洗解决方案，使芯片制造商可以制造出比沙粒还小1000倍以上的器件特征，帮助客户制造出更小、更快、更节能和性能更卓越的芯片。通过合作、持续创新和兑现承诺，泛林集团正在改变原子级的工艺技术，并携手客户塑造科技的未来。泛林集团总部位于美国加利福尼亚州弗里蒙特市，是一家纳斯达克100指数（NASDAQ-100 Index®）和标准普尔500强（S&P 500®）公司，其普通股以股票代码LRCX在纳斯达克全球精选市场（NASDAQ Global Select Market SM）上交易。欲了解更多信息，请访问：www.lamresearch.com。