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中文摘要:超声换能器被广泛应用于医疗成像、工业无损检测、汽车超声波雷达等。基于体压电材料的传统超声换能器具有体积大、不易加工、低带宽等缺点,限制了其在很多高端智能系统以及消费电子的应用。针对以上迫切需求,MEMS技术为超声换能器的发展与应用注入了新的动力,在降低大批量生产成本的同时,实现了低功耗、小型化、一体化集成的高性能微型超声换能器(MUT)阵列。MUT把超声技术的应用推向了新的高度,实现了其在智能手机、汽车电子、智能家居、自动驾驶、机器人以及医疗器械等新兴领域的应用包括超声指纹识别传感器、XR/元宇宙的人机交互、即使诊断的超声成像设备、以及超声可穿戴等。本报告会侧重于介绍MUT的前沿进展包括其机理、工艺、系统集成、应用研究等。 个人介绍: 卢奕鹏,2022年入职北京大学集成电路学院副教授、研究员、博士生导师,入选国家级高层次人才计划。2015年于BSAC/UC Davis获博士学位(导师David Horsley),之后加入美国高通先进技术研发部(2015-2022),任高级主任工程师。主要开展压电MEMS、超声MEMS、传感器与执行器的设计、加工以及系统集成相关技术研究。主导开发了国际首例压电微型超声换能器(PMUT)指纹识别传感器,核心技术专利被领军公司竞买并产业化,出货超过数亿颗。迄今为止,在集成微纳系统和传感器领域顶级期刊(JMEMS, JSSC, TUFFC, APL等)和会议(MEMS, ISSCC, Transducers, IUS等)发表文章数十篇,拥有美国专利三十余项(其中二十余项已转让或形成产品并量产),英文书籍章节一项,并多次获得重要奖项包括MEMS,ISSCC会议最佳论文,the BEST of BSAC,Super Qualcomm Star等。担任领域内顶级国际期刊IEEE Transactions on UFFC副主编,顶级会议Solid-State Sensors, Actuators and Microsystems (Hilton Head) 2022技术委员会委员,IEEE International Ultrasonics Symposium(IUS) 2023技术委员会委员,IEEE SFBA MEMS & Sensor Chapter 委员会委员(2016-2022)等。
Title: Piezoelectric MEMS Ultrasonic Transducers Presenter: Yipeng Lu Associate Professor, Institute of Microelectronics, Peking University Abstract: Ultrasonic transducers have been widely used in medical imaging, industrial non-destructive testing, automotive ultrasonic radar, etc. Traditional ultrasonic transducers based on bulk piezoelectric materials have large size, low bandwidth, challenging process of array and integration, which limit their application in many high-end intelligent systems and consumer electronics. In response to the above urgent needs, MEMS technology has injected new impetus into the development and application of ultrasonic transducers. While reducing the cost of mass production, it has realized micromachined ultrasonic transducer (MUT) array with low power consumption, miniaturization, and integrated high-performance. MUT technology has pushed the application of ultrasonic technology to a new level, realizing its applications in emerging fields such as smartphones, automotive electronics, smart homes, autonomous driving, robots, and medical devices, including ultrasonic fingerprint recognition sensors, XR/metaverse HMI touch sensors, portable diagnostic ultrasound imaging equipment, and ultrasound wearables, etc. This talk will focus on introducing the frontier progress of MUT, including its mechanism, fabrication process, system integration, and applications, etc.
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