Recent Advances on Polymers and Polymer Nanocomposites  for Advance Electronic and Photonic Packaging Applications

 C.P. Wong, Y. Li, J. Xu, L. Zhu, H. Jiang, Y. Sun, J. Lu, Y. Xie,

School of Materials Science and Engineering

Georgia Institute of Technology, Atlanta, GA 30332-0245

SMT Center, Shanghai University

Phone: 404-894-6631; Fax: 404-894-9140

Email: cp.wong@mse.gatech.edu

The advances of semiconductor technology is mainly due to the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and non conductive), interlayer dielectrics(low k, low loss  dielectrics), encapsulants(discrete, wafer level packaging) , embedded passives(high K and high Q materials), superhydrophobic self-cleaning lotus effect surfaces,...etc. In this presentation, we will review some of the recent advances of polymeric materials and polymer nanocomposites that we are currently being investigated for these types of applications, such as lead-free electrically conductive adhesives (ECAs) for fine pitch and high current density interconnects, flip chip and wafer level underfills, reworkable underfills, as well as nano composites for  high k embedded capacitors and inductors for RF/wireless, and superhydrophobic self-clean surface  applications.

Prof. C. P. Wong is a Regents’ Professor and holder of  the Charles Smithgall Institute Endowed Chair(one of the two Institute Endowed Chairs at GT) at the School of Materials Science and Engineering at Georgia Institute of technology.  He received his B.S. degree from Purdue University, and his Ph.D. degree from the Pennsylvania State University. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University.

He joined AT&T Bell Laboratories as a member of the technical staff and has been involved with the research and development of the polymeric materials (inorganic and organic) for electronic and photonic applications. He became an AT&T Bell Laboratories Fellow (the most prestigious award bestowed by Bell Labs) for his fundamental contributions to low-cost high performance plastic packaging of semiconductors. Since 1996, he is a Professor at the School of Materials Science and Engineering at the Georgia Institute of Technology. He was named a Regents’ Professor((highest rank professor) in July 2000, elected the Class of 1935 Distinguished Professor in 2004 for his outstanding and substained  contributions in research, teaching and services, and named holder of the Georgia Tech Institute Endowed chair(one of the two Institute chairs) in 2005.

He received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the Georgia Tech Sigma Xi Faculty Best Research Paper Award in 1999, Best MS, PhD and Undergraduate Thesis Awards in 2002  and  2004, respectively,  the University Press (London) Award of Excellence, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, elected as holder of the Charles Smthgall Institute Endowed Chair at Georgia Tech in 2005, the Georgia Tech Outstanding PhD Thesis Advisor Award , the IEEE Components, Packaging and Manufacturing Technology  Field Award in 2006, the Sigma Xi’s Monie Ferst Award  in 2007 and the ASM’s TEEM Award in 2008.

He holds over  50 U.S. patents, numerous international patents, has published over 600 technical papers.

Dr. Wong is a Fellow of the IEEE and was the president of the IEEE-CPMT Society (1992 &1993).  He was elected a member of the National Academy of Engineering in 2000.