清华大学材料科学与工程研究院《材料科学论坛》
学术报告
题目：
相圖與其在電子軟銲中之應用
报告人：
陈信文 教授
（台湾新竹清华大学特聘教授兼學務長）
时间：
2009年7月17日（星期五） 10：30
地 点：
清华大学材料院学术报告厅（逸夫技术科学楼2－321）
联系人：唐子龙 老师 62783685
欢迎广大师生踊跃参加
摘要:
Electronic soldering has attracted a lot interests recently owing to the
Pb-free requirement of electronic products and the emerging of various
applications, such as flip chip and through silicon via technologies. Phase
diagrams are conventional materials wisdom and they contain condensed
materials phase equilibrium information which is essential to materials
processing. This talk first looks into phase diagrams of materials systems
of promising Pb-free solders. Some unusual materials phenomena, such as
abnormal melting, lower reaction rates at higher temperatures, up-hill
diffusion, are discussed. The phase diagrams are then used as keys to solve
these puzzles. In addition, some other interesting phenomena observed in the
soldering material systems, such as cathode and anode differences
(electromigration effect), cruciform pattern formation, and alternating
layer formation, are introduced as well.
講員: 陳信文Sinn-wen Chen
現職：台灣清華大學化學工程學系
職稱: 清華特聘教授(Tsing Hua Distinguished Professor) 兼學務長
(Dean of Student Affairs)
聯絡地址: 新竹市光復路二段101 號清華大學化工系
聯絡電話: 886-3-5721734
傳真號碼: 886-3-5715408
E-MAIL: swchen@mx.nthu.edu.tw
教育背景：
國立台灣大學化學工程，1979/9至1983/6，學士
University of Wisconsin-Madison，材料科學，1985/8至1987/6，碩士
University of Wisconsin-Madison，材料科學，1987/6至1990/8，博士
學術團體職務：
Journal of Electronic Materials Associate editor，2006/8 迄今
Nanoscience and Nanotechnology Letters Editorial Board Member， 2009/1迄今
台灣化學工程學會(常務)理事2003(08)/11 迄今
ASMAlloy Phase Diagram Committee Member 2006/8 迄今
TMS Alloy Phase Committee Chairperson 2004/3~ 2006/3
IUMRS Facets Editor 2000/11~2006/12
國科會工程處化工學門學門召集人2002/12~2005/12
中國化學工程學會學術委員會主任委員2003/2~ 2005/12
中國化學工程學會會刊及叢書委員會主任委員、總編輯2003/2~ 2005/2
主要工作經歷:
University of Wisconsin-Madison (Materials Science and Engineering Department)，Visiting Professor 2007/8~2007/12
Ecole Polytechnique de l'universite de Nantes (Laboratoire Genie des materiaux) Invited Professor 2002/6~ 2002/7
Lehigh University (材料科學與工程學系) Visiting Scholar 2000/6~ 2000/8
國立清華大學(化學工程學系) 系主任2004/8~ 2007/7
國立清華大學(教務處國際及推廣教育組) 組長1998/2~ 2004/7
國立清華大學(化學工程學系) 教授1997/8~迄今
國立清華大學(化學工程學系) 副教授1992/2~ 1997/7
Alcoa Research Center (Molten Metal Processing Division) Senior Scientist 1991/4~ 1992/1
Univ.ofWisconsin-Madison (MSE Dept) Research Associate 1990/8~ 1991/3
Refereed Paper
1. S.-W. Chen, C.-H. Jan, J.-C. Lin and *Y.A. Chang, 1989, "Phase Equilibria of
the Al-Li Binary System", Metallurgical Transactions A, Vol. 20A, 2247-2258.
2. S.-W. Chen, H.W. Beumler and *Y.A. Chang, 1991, "Experimental
Determination of the Phase Equilibria of Aluminum-Rich Al-Li-Cu Alloys",
Metallurgical Transactions A, Vol. 22A, 203-213.
3. S.-W. Chen and *Y. A. Chang, 1991, "Application of Thermodynamic Models to
the Calculation of Solidification Paths of Al-rich Al-Li Alloys", Metallurgical
Transactions A, Vol. 22A, 267-271.
4. S.-W. Chen, Y.Y. Chuang, *Y.A Chang and M.G. Chu, 1991, "Calculation of
Phase Diagrams and Solidification Paths of Al-rich Al-Li-Cu Alloys",
Metallurgical Transactions A, Vol. 22A, 2837-2848.
5. S.-W. Chen and *Y. A. Chang, 1992, "Microsegregation in Solidification of
TernaryAlloys", Metallurgical Transactions A, Vol. 23A, pp. 1038-1043.
6. A. Bolcavage, S.-W. Chen, C.R. Kao, *Y.A. Chang, and A. D. Roming, Jr., 1993,
"Phase Equilibria of the Cu-In System, I：Experimental Investigation", J. of
Phase Equilibria, Vol. 14(1), pp. 14-21.
7. C.R. Kao, A. Bolcavage, S.-L. Chen, S.-W. Chen, *Y.A. Chang, and A. D.
Roming, Jr., 1993, "Phase Equilibria of the Cu-In System ,II：Thermodynamic
Assessment and Calculation of Phase Diagram", J. of Phase Equilibria, Vol.
14(1), pp. 22-30.
8. *S.-W. Chen, 1993, "Interfacial Reactions in the Liquid (Ag,Cu)/Ni Diffusion
Couples", Materials Chemistry and Physics, Vol. 33, pp. 271-276.
9. *R.-F. Kuo, J.-J. Wu, W.-H. Lo, Y.-C. Tsui, H.-M. Chen and S.-W. Chen, 1995,
"The effect of hole size on the spiral fracture of cortical bone in a tubular
torsional model", Chinese Journal of Medical and Biological Engineering, Vol.
15(3), pp. 179-187.
10. *S.-W. Chen, C.-C. Huang and J.-C. Lin, 1995, "The Relationship between the
Peak Shape of a DTA Curve and the Shape of a Phase Diagram", Chemical
Engineering Science, Vol. 50(3), pp. 417-431. (NSC 82-0405-E-007-130)
11. C.-C. Huang and *S.-W. Chen, 1995, "Phase Equilibria of Al-rich Al-Cu-Mg
Alloys", Metallurgical and Materials Transactions A, Vol. 26A, pp. 1007-1011.
(NSC 83-0405-E-007-007)
12. C.-L. Tsao and *S.-W. Chen, 1995, "Interfacial Reactions in the Liquid
Diffusion Couples of Mg/Ni, Al/Ni, and Al/(Ni)-Al2O3 Systems", Journal of
Materials Science, Vol. 30, pp. 5215-5222. (NSC 83-0402-E-007-018)
13. C.-C. Chen and *S.-W. Chen, 1995, "Surface Treatment of Particles by Using
Fluidized Bed Technology", Journal of the Chinese Institute of Chemical
Engineers, Vol. 26(5), pp. 263-267. (NSC 83-0402-E-007-018)
14. *S.-W. Chen and C.-C. Huang, 1996, "Solidification Curves of Al-Cu, Al-Mg,
and Al-Cu-Mg Alloys", Acta Materialia, Vol. 44(5), pp. 1955-1965. (NSC
83-0405-E-007-007)
15. *S.-W. Chen and S.-C. Jeng, 1996, "Determination of the Solidification Curves
of Commercial Aluminum Alloys", Metallurgical and Materials Transactions A,
Vol. 27A, pp. 2722-2726. (NSC 84-2216-E-007-027)
16. H.-T. Luo and *S.-W. Chen, 1996, "Phase Equilibria of the Ternary Ag-Cu-Ni
System and the Interfacial Reactions in the Ag-Cu/Ni Couples", J. Materials
Science, Vol. 31(19), pp. 5059-5067. (NSC 82-0405-E-007-285)
17. *S.-W. Chen and S.-C. Jeng, 1997, “Determination of the Solidification Curves
of a Rene N4 Superalloy”, Metallurgical and Materials Transactions A, Vol. 28A,
pp. 503-504. (NSC 85-2216-E007-042)
18. C.-C. Chen and *S.-W. Chen, 1997, “Nickel and Copper Deposition on Al2
O3
and SiC Particulates by Using the Chemical Vapor Deposition-Fluidized Bed
Reactor Technique”, Journal of Materials Science, Vol. 32, pp. 4429-4435.
(NSC-84-2214-E-007-019)
19. S.-C. Jeng and *S.-W. Chen, 1997, "The Solidification Characteristics of the
6061 and A356 Aluminum Alloys and Their Ceramic Particle-Reinforced
Composites", Acta Materialia, Vol. 45(12), pp. 4887-4899.
(NSC85-2216-E-007-042)
20. L.-H. Su, Y.-W. Yen and *S.-W. Chen, 1997, “Interfacial Reactions in the Molten
Sn/Cu and Molten In/Cu Couples”, Metallurgical and Materials Transactions B,
Vol. 28B, pp. 927-934. (NSC 83-0115-C007-01-006E and NSC
86-2745-E-007-005R).
21. *S.-W. Chen, M.-H. Lin, B.-R. Shie, and J.-L. Wang, 1997, “Interfacial
reactions in As-Se/Zn”, Journal of Non-Crystalline Solids, Vol. 220, pp. 243-248.
(NSC 85-2815-C007-01-028E).
22. S.-D. Ho, Y.-M. Dai, *S.-W. Chen, and J.-L. Wang, 1997, "Microstructure,
Density and Microhardness of the As-Se-Tl Chalcogenide Glass", Journal of
Non-Crystalline Solids, Vol. 221, pp. 290-296, 1997.
23. W.-C. Liu, *S.-W. Chen and C.-M. Chen, 1998, "The Al\Ni Interfacial Reactions
Under the Influence of Electric Current", Journal of Electronic Materials, Vol.
27(1), L5-L8. (NSC86-2745-E-007-005R).
24. B.-R. Shie, *S.-W. Chen, and J.-L. Wang, 1998, "Interfacial Stability of the
As-Se-S/ZnS, As-Se-S/ZnSe, As-Se-Tl/ZnS, As-Se-Tl/ZnSe and Related
Systems", Journal of Non-Crystalline Solids, Vol. 231, pp.240-250.
25. *S.-W. Chen, C.-C. Lin, and C.-M. Chen, 1998, "Determination of the Melting
and Solidification Characteristics of Solders by Using DSC", Metallurgical and
Materials Transactions A, Vol. 29A, pp. 1965-1972. (NSC87-2214-E-007-021).
26. *S.-W. Chen, C.-M. Chen, and W.-C. Liu, 1998, "The Electric Current Effects
Upon the Sn\Cu and Sn\Ni Interfacial Reactions", Journal of Electronic
Materials, Vol. 27(11), pp. 1193-1198. (NSC87-2214-E-007-021).
27. C.-M. Chen and *S.-W. Chen, 1999, “Electric Current Effects Upon the Sn/Ag
Interfacial Reactions”, Journal of Electronic Materials, Vol. 28(7), pp. 902-906.
(SCI,EI), (NSC87-2214-E-007-021).
28. Y.-M. Dai, *S.-W. Chen, C.-H. Chen and J.-L. Wang, 1999, “Glass Formation,
Density, Microhardness, and Optical Properties of As-Si-Te Chalcogenide
Alloys”, Journal of Non-Crystalline Solids, Vol. 255, pp. 217-227. (SCI, EI),
29. *S.-W. Chen and Y.-W. Yen, 1999, “Interfacial Reactions in the Ag-Sn/Cu
Couples”, Journal of Electronic Materials, Vol. 28(11), pp. 1202-1207. (SCI,
EI), (NSC87-2214-E-007-021).
30. C.-H. Chen, *S.-W. Chen, and J.-L. Wang, 1999, "Interfacial Reactions in
As-Te/Zn and As-Si-Te/Zn Systems", Chinese Journal of Materials Science,
Vol. 31(3), pp. 160-165.
31. Y.-W. Yen and *S.-W. Chen, 2000, "Ni and Cu Deposition on Fine Alumina
Particles by using the Chemical Vapor Deposition-Circulation Fluidized Bed
Reactor", Journal of Materials Science, Vol. 35, pp. 1439-1444. (SCI, EI),
(NSC85-2214-E-007-023).
32. *S.-W. Chen and S.-J. Luo, 2000, "Interfacial Reactions in Pt/Ti, Pt/Zr, Pt/TiO2
and Pt/ZrO2 Couples", Industrial & Engineering Chemistry Research, Vol. 39(2),
pp. 547-549. (NSC87-CPC-E-007-010). (SCI, EI),
33. *S.-W. Chen, C.-S. Ho, C.-H. Lin, and C.-M. Chen, 2000, "The 900oC
Isothermal Section of Ti-Ni-V Alloys", Metallurgical and Materials Transactions
A, Vol. 31A, pp. 1679-1682. (NSC88-2216-E-007-039). (SCI, EI),
34. C.-M. Chen and *S.-W. Chen, 2000, "Electromigration effect upon the Zn/Ni
and Bi/Ni interfacial reactions", Journal of Electronic Materials, Vol. 29(10), pp.
1222-1228. (SCI, EI), (NSC89-2214-E-007-006).
35. C.-H. Chen, *S.-W. Chen, and J.-L. Wang, 2001, "Properties of As-Te Alloys
and Their Interfacial Reactions with Zn Substrate", Materials Chemistry and
Physics, Vol. 70(3), pp. 316-325. (SCI, EI),
36. C.-H. Wang, *S.-W. Chen, C.-H. Chang, and J.-C. Wu, 2001, "Phase
Transformations at the Coating-Substrate Interface in Thermal Spraying",
Journal of Chinese Foundrymen's Association Quarterly, Vol. 27(1), pp. 12-16.
37. C.-M. Chen and *S.-W. Chen, 2001, "Electromigration Effect upon the
Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni Interfacial Reactions", Journal of
Applied Physics, Vol. 90(3), pp. 1208-1214. (SCI, EI),
38. *S.-W. Chen and Y.-W. Yen, 2001, "Interfacial Reactions in the Sn-Ag/Au
Couples", Journal of Electronic Materials, Vol. 30(9), pp. 1133-1137. (SCI, EI),
39. C.-T. Lee and *S.-W. Chen, 2002, "Quantities of Grains and Those of TiB2 and
Al3Ti Particles Added in the Grain-Refining Processes", Materials Science and
EngineeringA, Vol. 325 (1-2), pp. 242-248. (SCI, EI),
40. C.-Y. Huang and *S.-W. Chen, 2002, "Interfacial reactions in In-Sn/Ni couples
and phase equilibria of In-Sn-Ni system", Journal of Electronic Materials, Vol.
31(2), pp. 152-160. (SCI, EI), (NSC89-2214-E-007-006).
41. S.-J. Luo, C.-H. Wang and *S.-W. Chen, 2002, "Phase Equilibria of the Ternary
Ni-Cr-Zr System and Interfacial Reactions in the Ni-Cr/Zr Couples",
Metallurgical and Materials Transactions A, Vol. 33A, pp. 995-1002. (SCI, EI),
(NSC88-TPC-7-007-006).
42. C.-M. Chen and *S.-W. Chen, 2002, "Electromigration Effect upon the Sn/Ag
and Sn/Ni Interfacial Reactions at Various Temperatures", Acta Materialia, Vol.
50(9), pp. 2461-2469. (SCI, EI), (NSC89-2214-E-007-006).
43. C.-H. Lin, *S.-W. Chen and C.-H. Wang, 2002, "Phase Equilibria and
Solidification Properties of Sn-Cu-Ni Alloys", Journal of Electronic Materials,
Vol. 31(9), pp. 907-915. (SCI, EI), (NSC89-2623-7-007-007)
44. H.-Y. Chen, *S.-W. Chen and S.-H. Wu, 2003, "Glass Formation, Physical
Properties and Optical Properties of Ge-Se-Sn and Ge-Sb-Se-Sn Alloys",
Materials Chemistry and Physics, Vol. 80, pp. 176 – 185. (SCI, EI),
(88CS-D-007-010). (Impact factor: 1.183, 2003)
45. C.-H. Wang, *S.-W. Chen, C.-H. Chang and J.-C. Wu, 2003, "Phase equilibria of
the ternary Al-Cu-Ni system and interfacial reactions of related systems at
800oC", Metallurgical and Materials Transactions A, Vol. 34A, pp. 199-209.
(SCI, EI), (NSC90-2623-7-007-007). (Impact factor: 1.285, 2003)
46. *S.-W. Chen and C.-M. Chen, 2003, "Electromigration effects upon interfacial
reactions", JOM, Vol. 55(2), pp.62-67. (SCI, EI), (NSC89-2623-7-007-007)
(Impact factor: 0.852, 2003)
47. J.-I Lee, *S.-W. Chen, H.-Y. Chang and C.-M. Chen, 2003, "Reactive wetting
between molten Sn-Bi and Ni substrate", Journal of Electronic Materials, Vol. 32
(3), pp. 117-122. (SCI, EI), (NSC89-2623-7-007-007). (Impact factor: 1.457,
2003)
48. C.-M. Chen and *S.-W. Chen, 2003, "Electromigration effect upon the
low-temperature Sn/Ni interfacial reactions", Journal of Materials Research, Vol.
18 (6), pp. 1293-1296. (SCI, EI), (NSC90-2214-E-007-001). (Impact factor:
1.635, 2003)
49. H.-Y. Chang, *S.-W. Chen, D. S.-H. Wong and H.-F. Hsu, 2003, "Determination
of reactive wetting properties of Sn, Sn-Cu, Sn-Ag and Sn-Pb alloys by using a
wetting balance technique", Journal of Materials Research, Vol. 18 (6), pp.
1420-1428. (SCI, EI), (NSC91-2214-E-007-013). (Impact factor: 1.635, 2003)
50. C.-H. Wang and *S.-W. Chen, 2003, "Isothermal section of the ternary Sn-Cu-Ni
system and interfacial reactions in the Sn-Cu/Ni couples at 800oC", Metallurgical
and Materials Transactions A, Vol. 34A, pp. 2281-2287. (SCI, EI),
(NSC89-2623-7-007-007). (Impact factor: 1.285, 2003)
51. *S.-W. Chen, S.-H. Wu and S.-W. Lee, 2003, “Interfacial reactions in the
Sn-(Cu)/Ni, Sn-(Ni)/Cu and Sn/(Cu,Ni) systems”, Journal of Electronic
Materials, Vol. 32(11), pp. 1188-1194. (SCI, EI), (NSC91-2214-E-007-013).
(Impact factor: 1.457, 2003)
52. *S.-W. Chen, S.-W. Lee and M.-C. Yip, 2003, “Mechanical Properties and
Intermetallic Compound Formation at the Sn/Ni and Sn-0.7wt%Cu/Ni Joints”,
Journal of Electronic Materials, Vol. 32(11), pp. 1284-1289. (SCI, EI),
(NSC91-2214-E-007-013). (Impact factor: 1.457, 2003)
53. M.-Y. Du, C.-M. Chen and *S.-W. Chen, 2003, "Effects upon interfacial
reactions by electric currents of reversing directions", Materials Chemistry and
Physics, Vol. 82(3), pp. 818-825. (SCI, EI), (NSC89-2214-E-007-006). (Impact
factor: 1.183, 2003)
54. *S.-W. Chen, S.-K. Lin and J.-M. Jao, 2004, “Electromigration effects upon
interfacial reactions in the flip-chip solder joints”, Materials Transactions JIM,
Vol. 45(3), pp. 661-665, (NSC91-2214-E-007-013). (Impact factor: 1.159, 2003)
55. H.-F. Hsu and *S.-W. Chen, 2004, “Phase equilibria of the Sn-Ag-Ni ternary
system and interfacial reactions at the Sn-Ag/Ni joints”, Acta Materialia, Vol.
52(9), pp. 2541-2547. (SCI, EI) (NSC91-2214-E-007-013). (Impact factor: 3.059,
2003)
56. *S.-W. Chen, S.-K. Lin and C.-Y. Chou, 2004, ”Investigation of reactive
wetting” (in Chinese), Journal of the Chinese Colloid and Interface Society, Vol.
26(2), pp. 83-88. (NSC92-2214-E-007-002).
57. *S.-W. Chen, H.-F. Hsu and C.-W. Lin, 2004, “Liquidus projection of the ternary
Ag-Sn-Ni alloys”, Journal of Materials Research, Vol. 19(8), pp. 2262-2267.
(NSC 91-2214-E-007-013). (Impact factor: 1.635, 2003)
58. Y.-W. Yen and *S.-W. Chen, 2004, “Phase Equilibria of the Ag-Sn-Cu Ternary
System”, Journal of Materials Research, Vol. 19(8), pp. 2298-2305.
(NSC89-2214-E-007-006). (Impact factor: 1.635, 2003)
59. *S.-W. Chen, J.-I Lee and C.-N. Chiu, 2004, “Liquidus projection of the ternary
As-Sn-Te system”, Scripta Materialia, Vol. 51(9), pp. 853-856.
(NSC91-2214-E-007-013). (Impact factor: 1.633, 2003)
60. *S.-W. Chen and C.-A. Chang, 2004, “Phase equilibria of the Sn-Ag-Cu-Ni
quaternary system at the Sn-rich corner”, Journal of Electronic Materials, Vol.
33(10), pp. 1071-1079, (NSC92-2214-E007-002). (Impact factor: 1.457, 2003)
61. C.-M. Chen, *S.-W. Chen, J.-J. Ko, and H.-P. Pu, 2004, “Effects of Au and Ni
layers on the interfacial reactions of the flip chip solder joints" (in Chinese),
Journal of the Chinese Colloid and Interface Society, Vol. 26, pp. 119-128.
62. C.-A. Chang, *S.-W. Chen, C.-N. Chiu and Y.-C. Huang, 2005, “Primary
solidification phases of the Sn-rich Sn-Ag-Cu-Ni quaternary system”, Journal of
Electronic Materials, Vol. 34(8), pp. 1135-1142. (NSC92-2214-E-007-002).
(Impact factor: 1.457, 2003).
63. *S.-W. Chen, C.-L. Yang, C.-W. Lin and F.-L. Chen, 2005, “Materials for Dental
Arch Wires” (in Chinese), Chemical Engineering, Vol. 52(4), pp. 113-118.
(NSC 93-2214-E-007-001)
64. *S.-W. Chen, 2005, "Phase transformation and formations of significant
importance", JOM, Vol. 57(9), p. 18. (NSC 93-2216-E-007-043).
65. C.-N. Chiu, Y.-C. Huang, A.-R. Zi and *S.-W. Chen, 2005, "Isoplethal sections
of the liquidus projection and the 250oC phase equilibria of the Sn-Ag-Cu-Ni
quaternary system at the Sn-rich corner", Materials Transactions, Vol. 46(11), pp.
2426-2430. (NSC93-2214-E-007-001) (Impact factor: 1.159, 2003)
66. C.-H. Wang and *S.-W. Chen, 2006, "Sn-0.7wt%Cu/Ni interfacial reactions at
250oC", Acta Materialia, Vol. 54(1), pp. 247-253. (NSC 93-2216-E-007-043).
67. C.-Y. Chou and *S.-W. Chen, 2006, "Interfacial reactions and phase equilibria in
the Al-Cu/Ta systems", Journal of Electronic Materials, Vol. 35(1), pp. 22-27.
(NSC93-2214-E-007-001)
68. *S.-W. Chen, S.-K. Lin, and C.-F. Yang, 2006, " Interfacial Reactions in the
Pb-Free Composite Solders with Indium Layers”, Journal of Electronic Materials,
Vol. 35(1), pp. 72-75. (NSC92-2214-E-007-022).
69. C.-H. Wang and *S.-W. Chen, 2006, "Electric current effects in the flip chip
solder joints", Journal of the Chinese Institute of Chemical Engineers, Vol. 37(2),
pp. 185-191, (NSC93-2214-E-007-001).
70. *S.-W. Chen, C.-L. Yang and C.-W. Lin, 2006, “Colorful Dental Archwires”,
Journal of the Chinese Institute of Chemical Engineers, Vol. 37(2), pp. 193-194,
(NSC-92-2214-E-007-002).
71. C.-Y. Chou and *S.-W. Chen, 2006, "Phase Equilibria of the Sn-Zn-Cu Ternary
System", Acta Materialia, Vol. 54(9), pp. 2393-2400. (NSC93-2214-E-007-001)
72. *S.-W. Chen and S.-K. Lin, 2006, "Effects of temperature on interfacial
reactions in -InSn4/Ni couples", Journal of Materials Research, Vol. 21(5), pp.
1161-1166. (NSC-94-2214-E-007-006)
73. C.-C. Chen, *S.-W. Chen and C.-Y. Kao, 2006, "Interfacial reactions in the
Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-rich
corner", Journal of Electronic Materials, Vol. 35(5), pp. 922-928.
(NSC93-2216-E007-043)
74. S.-K. Lin and *S.-W. Chen, 2006, “Interfacial reactions in the Sn-20at%In/Cu
and Sn-20at%In/Ni couples at 160oC”, Journal of Materials Research, Vol. 21(7),
pp. 1712-1717. (NSC-94-2214-E-007-006)
75. C.-Y. Chou, *S.-W. Chen and Y.-S. Chang, 2006, "Interfacial Reactions in the
Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni Couples", Journal of Materials Research,
Vol. 21(7), pp. 1849-1856. (NSC93-2214-E-007-001)
76. Y.-C. Huang, *S.-W. Chen, C.-H. Chang and C.-C. Wu, 2006, ”Thermal spray
processes and heat treatments of thermal sprayed objects” (in Chinese), Chemical
Engineering, Vol. 53(3), pp. 69-77. (NSC94-2214-E-007-006).
77. *S.-W. Chen and C.-H. Wang, 2006, "Interfacial reactions of Sn-Cu/Ni couples
at 250C”, Journal of Materials Research, Vol. 21(9), pp. 2270-2277.
(NSC94-2214-E-007-006).
78. C.-C. Chen and *S.-W. Chen, 2006, "The Sn/Ni-7wt.%V interfacial reactions",
Journal of Electronic Materials, Vol. 35(9), pp. 1701-1707.
(NSC93-2216-E-007-043)
79. C.-L. Yang, F.-L. Chen and *S.-W. Chen, 2006, "Anodization of the dental arch
wires", Materials Chemistry and Physics, Vol. 100, pp. 268-274. (NSC
93-2214-E-007-001)
80. *S.-W. Chen, P.-Y. Chen and C.-H. Wang, 2006, "Melting point lowering of the
Sn-Sb alloys caused by substrate dissolution”, Journal of Electronic Materials,
Vol. 35(11), pp. 1982-1985. (NSC94-2214-E-007-006).
81. *S.-W. Chen and S.-K. Lin, 2006, "Electric Current-Induced Abnormal
Cu/-InSn4 Interfacial Reactions", Journal of Materials Research, Vol. 21(12),
pp. 3065-3071, (NSC 94-2214-E-007-006).
82. *S.-W. Chen and C.-N. Chiu, 2007, "Unusual cruciform pattern interfacial
reactions in the Sn/Te couples", Scripta Materialia, Vol. 56(2), pp. 97-99,
(NSC94-2216-E007-047).
83. *S.-W. Chen, C.-H. Wang, S.-K. Lin and C.-N. Chiu, 2007, "Phase Diagrams of
Pb-Free Solders and their Related Materials Systems”, Journal of Materials
Science: Materials in Electronics, (invited review), Vol. 18, pp. 19-37.
(NSC94-2214-E-007-006)
84. *S.-W. Chen, C.-H. Wang, S.-K. Lin, C.-N. Chiu and C.-C. Chen, 2007, "Phase
transformation and microstructural evolution in the solder joints", JOM, Vol.
59(1), pp. 41-45. (NSC94-2214-E-007-006)
85. *S.-W. Chen, C.-C. Chen and C.-H. Chang, 2007, "Interfacial Reactions in
Sn/Ni-7wt.%V Couple", Scripta Materialia, Vol. 56(6), pp.453-456,
(NSC94-2216-E007-047).
86. *S.-W. Chen and C.-H. Wang, 2007, "Effects of electromigration on interfacial
reactions in cast Sn/Cu joints", Journal of Materials Research, Vol. 22(3), pp.
695-702, (NSC94-2216-E-007-047)
87. *S.-W. Chen, C.-N. Chiu and K.-C. Hsieh, 2007, "Phase equilibria of the
Sn-Ag-Cu-Ni quaternary system at the 210oC", Journal of Electronic Materials,
Vol. 36(3), pp. 197-206. (NSC 93-2214-E-007-001)
88. S.-K. Lin, Y. Yorikado, J. Jiang, K.-S. Kim, *K. Suganuma, *S.-W. Chen, M.
Tsujimoto and I. Yanada, 2007, "Mechanical deformation-induced Sn whiskers
growth on electroplated films in the advanced flexible electronic packaging",
Journal of Materials Research, Vol. 22(7), pp. 1975-1986.
89. C.-M. Hsu, *D. S.-H. Wong, and S.-W. Chen, 2007, “A Generalized
Phenomenological Model for the Effect of Electromigration on Interfacial
Reaction”, Journal of Applied Physics, Vol. 102(2), 023715.
90. *S.-W. Chen and C.-C. Chen, 2007, "Interfacial Reactions in
Sn-0.7wt.%Cu/Ni-V Couples at 250oC”, Journal of Electronic Materials, Vol.
36(9), pp. 1121-1128. (NSC93-2216-E007-043)
91. Y.-C. Huang, *S.-W. Chen, C.-H. Chang, J.-C. Wu and W. Gierlotka, 2007,
“Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders”,
Journal of Materials Research, Vol. 22(10), pp. 2924-2929.
(NSC95-2221-E-007-205)
92. C.-F. Yang, *S.-W. Chen, K.-H. Wu and T.-S. Chin, 2007, “Interfacial reactions
of Sn-8wt.%Zn-3wt.%Bi solder with Cu, Ni and Ag substrates”,Journal of
Electronic Materials, Vol. 36(11), pp. 1524-1530. (NSC95-2218-E-007-028)
93. W. Gierlotka, *S.-W. Chen and S.-K. Lin, 2007, "Thermodynamic description of
the Cu–Sn system", Journal of Materials Research, Vol. 22(11), pp 3158-3165.
(NSC95-2221-E-007-205)
94. C.-H. Wang and *S.-W. Chen, 2007, "Cruciform pattern formation in Sn/Co
couples", Journal of Materials Research, Vol. 22(12) , pp 3404-3409.
(NSC95-2218-E-007-028)
95. S.-K. Lin, Y. Yorikado, J. Jiang, K.-S. Kim, *K. Suganuma, *S.-W. Chen, M.
Tsujimoto and I. Yanada, 2007, "Microstructure development of mechanical
deformation-induced tin whiskers ", Journal of Electronic Materials, Vol. 36(12),
pp. 1732-1734.
96. C.-N. Chiu, C.-H. Wang and *S.-W. Chen, 2008, “Interfacial reactions in the
Sn-Bi/Te couples”, Journal of Electronic Materials, Vol. 37(1), pp. 40-44.
(NSC95-2218-E-007-028)
97. W. Gierlotka and *S.-W. Chen, 2008, "Thermodynamic descriptions of the
Cu-Zn system", Journal of Materials Research, Vol. 23(1), pp. 258-263.
(NSC95-2221-E-007-205)
98. Y.-H. Chao, *S.-W. Chen, C.-H. Chang and C.-C. Chen, 2008, "Phase equilibria
of Sn-Co-Ni system and interfacial reactions in Sn/(Co, Ni) couples",
Metallurgical and Materials Transactions A, Vol. 39(3), pp. 477-489.
(NSC95-2221-E-007-205)
99. S.-K. Lin, C.-F. Yang, S.-H. Wu, and *S.-W Chen, 2008, "Liquidus projection
and solidification of the Sn-In-Cu ternary alloys", Journal of Electronic Materials,
Vol. 37(4), pp. 498-506. (NSC 96-2221-E-007 -001)
100.C.-C. Chen, *S.-W. Chen and C.-H. Chang, 2008, “Electromigration effects
upon the Sn/Ni-7wt.%V interfacial reactions”, Journal of Applied Physics, Vol.
103(6), 063518. (NSC95-2218-E007-028)
101.C.-H. Wang and *S.-W. Chen, 2008 "Interfacial reactions in Sn-(Cu)/Cu6Sn5/Ni
couples at 210oC", Intermetallics, Vol. 16, pp. 531-537.
(NSC95-2221-E-007-205)
102.C.-C. Wang and *S.-W. Chen, 2008, "Sn/Co solid/solid interfacial reactions",
Intermetallics, Vol. 16, pp. 524-530. (NSC96-2221-E-007 -001)
103. *S.-W. Chen, C.-C. Chen, W. Gierlotka, A.-R. Zi, P.-Y. Chen and H.-J. Wu, 2008,
"Phase equilibria of the Sn-Sb binary system", Journal of Electronic Materials,
Vol. 37(7), pp. 992-1002. (NSC95-2218-E007-028)
104.C.-C. Chen, *S.-W. Chen and C.-H. Chang, 2008, "Solid/solid Interfacial
Reactions between Sn-0.7wt.%Cu and Ni-7wt.%V", Journal of Materials
Research, Vol. 23(7), pp. 1895-1901. (NSC NSC93-2216-E007-043)
105. *S.-W. Chen, A.-R. Zi, P.-Y. Chen, H.-J. Wu, Y.-K. Chen and C.-H. Wang, 2008,
"Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples", Materials
Chemistry and Physics, Vol. 111(1), pp. 17-19. (NSC95-2218-E007-028)
106. C.-F. Yang, F.-L. Chen,W. Gierlotka, *S.-W. Chen, K.-C. Hsieh, L.-L. Huang,
2008, "Thermodynamic properties and phase equilibria of Sn-Bi-Zn ternary
alloys", Materials Chemistry and Physics, Vol. 112(1), pp. 94-103. (NSC
95-2218-E-007-028)
107.C.-C. Chen, W. Gierlotka and *S.-W. Chen, 2008, "Phase Equilibria of Sn-V
System and Interfacial Reactions in Sn/V couples", Journal of Electronic
Materials, Vol. 37(11), pp. 1727-1733. (NSC95-2218-E007-028)
108. *C.-C. Chen, S.-W. Chen and C.-H. Chang, 2008, "Characterizations of the
Ternary Phase Formed at the Sn/Ni-V joint", Journal of Materials Research, Vol.
23(10), pp. 2743-2748. (NSC95-2218-E007-028)
109. *S.-W. Chen, P.-Y. Chen, C.-N. Chiu, Y.-C. Huang and C.-H. Wang, 2008,
"Phase equilibria of Sn-Sb-Ag ternary system (I): Experimental", Metallurgical
and Materials Transactions A, Vol. 39A, pp. 3191-3198.
(NSC96-2221-E-007-001)
110.W. Gierlotka, Y.-C. Huang and *S.-W. Chen, 2008, "Phase equilibria of
Sn-Sb-Ag ternary system (II): Calculation", Metallurgical and Materials
Transactions A, Vol. 39A, pp. 3199-3209. (NSC96-2221-E-007-001)
(* corresponding author)
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