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集成电路系列学术邀请报告——Chiplet设计与异质集成封装
Global Quantum Communication Network and Future Aspects
面向高比能电池材料的表界面工程
高电压固态电池用聚合物基固态电解质
报告题目:
Strain Engineering and Nanomechanical Architecture for Self-assembly of Nanostructures
 报告人:
刘峰 (Liu,feng)教授
美国犹他大学材料系,清华大学物理系系友
报告时间:
2006-04-29 15:10
报告地点:
清华大学理科楼1112房间
主办单位:
清华大学物理系
  简介:

内容简介:

Controlled and consistent fabrication of different classes and shapes of nanostructures will be a requirement if nanotechnology expects to achieve its promised impact on society. One attractive approach towards nanofabrication is to “let nature do it.”  In this talk, I will demonstrate a unique “natural” path to fabricating nanostructures by strain-engineered and nanomechanics-architectured self-assembly of thin films. I will first report the most recent development in the strain-engineered growth of quantum dots on patterned substrates and on freestanding nanomembranes. I will then illustrate the design principles of an emerging novel nanofabrication approach based on the nanomechanical architecture of strained thin films. This approach is completely compatible with the current Si technology. It demonstrates the possibility of fabricating nanostructures with an unprecedented level of control over their size, geometry, and uniformity. It possesses an unparallel level of versatility for making nanostructures with a single material as well as with combinations of different materials. Finally, I will demonstrate some surprising mechanical bending behavior of nanoscale thin films that is qualitatively different from that of macroscopic thick films. In particular, I will show how the atomic-level surface stress dominates over the bulk stress in bending a film that is down to a few nanometers thick.

 

 

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