Abstract:

Over the last decade, IC Organic Substrates for Semiconductor Packages, such as BGA (Ball Grid Array), LGA (Land Grid Array), CSP (Chip Scale Packages) and SiP (System in Package) have evolved to become the essential building blocks for Chip integration into electronic systems. Today, IC Organic Substrates, can be found in most electronic systems, from handheld devices like mobile and smart-phones, to more expensive systems that move massive amount of data through the internet, to high reliability modules for harsh military environment.

The objective of the following presentation is to expose the attendees to the challenges handheld devices bring to Semiconductor packages in general - and to IC Substrates in particular. If in the past, IC Substrates technologies were driven by material sets and processes  from the PCB (Printed Circuit Board) industry, today it is already clear that Organic IC Substrates will have to rely more and more on wafer FAB technologies in  order to bring performance at cost.

 

Dror Hurwitz is the CEO and founder of ACCESS Technologies, a Shino-Israeli High-Tech Joint Venture Company that Develops, Manufactures and Markets System in Package (SiP) modules for the RF, Wireless and Base-band Semiconductor Industry. The Company uses Tier One, break-through,   revolutionary technology that has enabled major hand-held device manufactures to enhance performance and reduce cost. ACCESS is currently in Mass Production Phase shipping millions of units per week to all Industry Key accounts including end-users such as Samsung, LG, Apple, RIM, HTC, Motorola and others. Previously, Dror was the President and founder of   AMITEC Ltd., an Israeli IP and Know-how Company focusing on advanced electronic interconnect structures, IC substrates and semiconductor packaging solutions. Before establishing AMITEC, Dror served as the CTO and VP of Engineering for Tadiran Ltd., an Israeli global leader of tactical radio and Avionic communication systems. Dror is a world-wide renowned authority in the field of Electronic Packaging with over 25 years of industry experience. He is the holder of 15 granted patens in US, Japan, Korea and Europe and holds more patent applications in the field of IC packaging and Interconnect Technologies. Dror Holds a B.SC degree in Chemical Engineering from the Technion – the Israeli Institute of Technology - and has further participated in Technical and Managerial Programs at IBM, Germany and Lockheed-Martin, USA. Dror holds an Israeli citizenship and used to split his time between Israel and North America - for marketing purposes. For the last 3 years he lives in China.