Abstract
The innovation of 3D IC integration has been successfully applied to address the gap seen between the slowdown of Moore’s law scaling and the ever increasing system performance requirements.  3D ICoffers the advantages of reducing power consumption, improving the bandwidth between the ASIC and memory and modularizing system hardware designs.  In this talk, critical technologies, fabrication process, and design considerations will be discussed for high performance networking and Datacenter applications.

Bio
Jie Xue is currently a Sr. director of Technology and Quality at Cisco Systems, Inc., San Jose, California. Her team is responsible for technology roadmap, technology development, quality and reliability for all Cisco products. Prior to joining Cisco, Jie held several management and engineering positions in Motorola Inc., working on R&D and product development.  Jie received a BS degree from Tsinghua University, a MS and Ph.D. from Cornell University. She published over 80 technical papers, and is an IEEE Fellow and IMAPS Fellow. Currently, she is the IEEE-CPMT president 2014-2015.