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报告题目:
Introduction of MC-SPG Method and its Application in the Automotive Industry
 报告人:
Dr. Xiaofei Pan
Livermore Software Technology Corporation, USA
报告时间:
2019-10-21 10:00
报告地点:
蒙民伟科技大楼北楼N412会议室
主办单位:
清华大学航天航空学院航空宇航工程系
  简介:

简介航空系系列学术报告2019年秋季学期第四场

主持人:张雄教授清华大学航天航空学院

报告摘要

As automotive industry moves rapidly towards electrified and digitalized world, the use of lightweight materials and new joining technologies becomes crucial to counteract the weight of electronic and autonomous equipment for energy efficiency as well as to maintain safety and performance. Numerical modeling of the joined structures including their failure behavior and manufacturing processes has been a big challenge in the modern lightweight vehicle safety design. In order to improve the computational efficiency as well as to avoid the fundamental complication in the stabilization stress calculation, a momentum-consistent smoothing particle Galerkin (MC-SPG) formulation was recently developed. In this new formulation, a velocity smoothing algorithm was introduced to stabilize the solution. It leads to a new stabilization formulation without use of residual or non-residual stabilization terms. Combined with FEM and immerse technique, MC-SPG has been successfully applied in the simulation of various manufacturing problems such as the friction drilling, flow drill screw (FDS), self-piercing rivet (SPR),  failure of carbon fiber reinforced polymer composite (CFRP) in meso-scale level, and so on.

报告人简介

Dr. Xiaofei Pan received his PhD degree from the school of Aerospace at Tsinghua University in 2006, then worked at the institute of applied Mathematics and Computational Physics in Beijing from 2006 to 2007, and at the department of engineering mechanics in Germany from 2007 to 2010. From 2010 to 2017 Dr. Pan worked as senior computational engineer in Germany.  In 2017, Dr. Pan joined the computational and multiscale mechanics group at Livermore Software Technology Corporation (LSTC) in USA, focused on the development of MC-SPG method and its application in the automotive and IC electronic packaging industry.


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