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A Transcription Factor Network Mediating Tumor Promotion and Tumor Suppression
Epitranscriptic regulation in the mature nervous system
piRNA Protects the Germline Genome from Transposon Invasion
清华大学材料科学与工程研究院《材料科学论坛》:Introduction to piezoelectric M...
报告题目:
Nano Self-Assembly of MEMS and Flexible Electronics
 报告人:
Tianhong Cui
Dept. of Mechanical Engineering/ Nanofabrication Center
 Univ. of Minnesota, UAS
报告时间:
2007-10-15 10:30
报告地点:
精仪系(9003大楼)4楼会议室
主办单位:
精仪系
  简介:

This talk presents the combination of “bottom-up” layer-by-layer (LbL) nano self-assembly and “top-down” micromanufacturing techniques for MEMS and electronics for potential biomedical applications. With nano self-assembly and surface micromachining, highly flexible nanoparticle-based magnetic cantilever platform for micro sensing and actuation was fabricated

successfully. For flexible electronics devices, self-assembled silica nanoparticle thin film acted as the dielectric layer for field-effect transistors. Nanoparticle- and polymer-based field-effect transistors with embedded self-assembled films as dielectric and active layers were fabricated and characterized successfully as well. These self-assembled field-effect transistors were primarily investigated for bio-sensing applications.

 

BIOGRAPHY: Tianhong Cui is currently the Richard & Barbara Nelson Associate Professor of Mechanical Engineering at the University of Minnesota. From 1995 to 2003, he held research or faculty positions at Tsinghua University, University of Minnesota, National Laboratory of Metrology in Japan, and Louisiana Tech University, respectively. He received his B.S. from Nanjing University of Aeronautics and Astronautics in 1991, and his Ph.D. with honors from Chinese Academy of Sciences in 1995.  He has more than 100 publications in MEMS and nanotechnology. His research has been sponsored by NSF, DARPA, NASA, NIH, etc. He received research awards including the Endowed Chair from the University of Minnesota, the Research Foundation Award from Louisiana Tech University, the Alexander von Humboldt Award in Germany, and the STA & NEDO fellowships in Japan. He is a senior member of IEEE and a member of ASME. He is serving as an associate editor for Journal of Nanoscience and Nanotechnology and Journal of Nano Research.

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