简介: |
Abstract: Light emitting diodes have been widely used in various applications such as road lighting, display, automotive, and even medical. The market is shown to be growing in the next ten years. DOE has predicted the growth of the LED market will be compared by the cost reduction, in particular, in terms of wafer processing, epitaxy, substrate, phosphor, and back end. In this talk, we will briefly mention the whole industry and their processes, in particular, the processes of typical LED packaging. The LED performances are affected by many factors, such as materials, design, manufacturing processes, environments of loading, etc. In this talk, a packaging design platform will be presented which cover the co-design issues involving optics, electronics, mechanics, materials, processes and equipment, etc. LED failure and degradation modes are also discussed. A few issues are discussed in the presentation, including the micro-stamp process modeling, temperature and moisture effect on the reliability, color spatial uniformity, and phosphor self-heating. Other topics of our research in MEMS/NEMS are also briefly discussed, including the development of MOCVD equipment.
Biographical Sketch: Sheng Liu received the B.S. and M.S. degrees in flight vehicle design from Nanjing University of Aeronautics and Astronautics, Nanjing, China, in 1983 and 1986, respectively, and the Ph.D. degree in mechanical engineering from Stanford University, Stanford, CA, in 1992. He was an Assistant Professor with the School of Mechanical and Aerospace Engineering, Florida Institute of Technology, Melbourne, from 1992 to 1995. In 1995, he became an Assistant Professor with the School of Mechanical Engineering and the Institute for Manufacturing Research (joint appointment), Wayne State University, Detroit, MI, where he became an Associate Professor in 1998 with tenure. In 2004, he came back to Huazhong University of Science and Technology, Wuhan, China, where he became a Full Professor with the School of Mechanical Science and Engineering, and the Director of the Institute of Microsystems, also ChangJiang Scholar Professor. He was also the Director with the Division of Micro-Opto-ElectronicMechanical Systems, Wuhan National Laboratory for Optoelectronics, Wuhan. He was also the executive director of Birdnest Program, initiated by Professor Gang Chen at MIT, Professor Chih-Ming Ho at UCLA, Prof. Zhigang Suo at Harvard, Professor Zhifeng Ren at University of Houston, with the aiming of recruiting and mentoring young faculty in a tenure track system similar to USA. He is currently the Dean of School of Power and Mechanical Engineering, Director of Cross-disciplinary Institute of Engineering Sciences, and Director of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan. His current research interests include light-emitting diodes, MEMS/NEMS, integrated circuit packaging, power electronics, and applied mechanics. Prof. Liu was evaluated to be ASME Fellow in 2009 and IEEE Fellow in 2013. He has won some prestigious awards such as Presidential Faculty Fellow Award in 1995, NSFC Young Scientist Award (B Type), ASME Young Engineer Award in 2006, IEEE CPMT Excellent Technical Achievement Award in 2009, to name a few. He has served as associate editors for a few packaging and MEMS journals. He has authored more than 140 SCI journal articles, two books by Wiley and filed or granted about 300 patents in China and abroad.
时 间:12月5日(周五) 上午10:00-11:30
地 点: 清华大学蒙民伟科技大楼北楼412室会议室 |
