This presentation will outline the future trend of microelectronics packaging, and review the current status of technology development and commercialization of 3D packaging. The challenges and opportunities for commercialization will be discussed, with a focus on the packaging industry and supply chain in China. Collaborative innovation for the development of emerging packaging technologies will be outlined, and the status of the materials and equipment supply chain will be reviewed, particularly on the various modules that enable 2.5D/3D packaging. The impact of the commercialization of 3D packaging on the supply chain will be discussed.